DQS Electronic Co., Limited
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SMT Assembly (Surface-Mount Technology Assembly) is the core process in mobile-phone PCB production where every tiny chip, resistor, capacitor, connector, etc. is placed and soldered onto the bare board without through-holes. In short, it turns the etched copper substrate into a functional circuit.
DIP Assembly (Dual In-line Package Assembly) is the through-hole step that comes after SMT in mobile-phone PCB production. Components whose leads are too large, need high mechanical strength, or carry high current (e.g., big connectors, shielding frames, some inductors, early-stage camera modules, or legacy ICs) are inserted into pre-drilled holes and then wave-soldered or hand-soldered to the board.
DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: info@dqspcba.com
| Item | Normal | Special |
|---|---|---|
| SMT Assembly | PCB(used for SMT) specification | |
| Length and Width( L* W) | ||
| Minimum | L≥3mm, W≥3mm | L＜2mm |
| Maximum | L≤800mm, W≤460mm | L＞1200mm, W＞500mm |
| Thickness( T) | ||
| Thinnest | 0.2mm | T＜0.1mm |
| Thickest | 4 mm | T＞4.5mm |
| SMT components specification | Outline Dimension | |
| Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) |
| Max size | 200 * 125 | 200 * 125 |
| component thickness | T≤15mm | 6.5mm＜T≤15mm |
| QFP,SOP,SOJ (multi pins) | ||
| Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm |
| CSP/ BGA | ||
| Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm |
| DIP Assembly | PCB specification | |
| Length and Width( L* W) | ||
| Minimum | L≥50mm, W≥30mm | L＜50mm |
| Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm |
| Thickness( T) | ||
| Thinnest | 0.8mm | T＜0.8mm |
| Thickest | 3.5mm | T＞2mm |
