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Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm

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DQS Electronic Co., Limited
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Country/Region:china
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Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm

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MOQ :1
Price :Contact Us
Payment Terms :T/T
Supply Ability :200,000+ m² PCB per Month
Layer :10 layers
Material :Fr4
Thickness :2.0 mm
Construction :2+N+2
Min. Line Width/Space :0.1/0.1mm
Surface Treatment :Immersion Gold
Type :Customizable
Application :Electronic Product
Standard :UL&IPC Standard &ISO
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Medical Electronics HDI Multilayer PCB Boards Manufacturer

♦ What Are Multilayer PCB Boards?

Multilayer PCBs​​ are printed circuit boards consisting of ​​three or more conductive copper layers​​, laminated together with insulating (dielectric) material. These layers are interconnected through ​​plated through-holes (PTHs), vias, or buried/blind vias​​, enabling complex circuit designs in a compact form.

Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm

♦ ​​Key Features of Multilayer PCBs​:

✅ ​​High Density​​ – More layers allow for more components and routing in a smaller space.

✅ ​​Improved Signal Integrity​​ – Dedicated power & ground planes reduce noise and EMI.

✅ ​​Better Thermal Management​​ – Heat spreads more efficiently across layers.

✅ ​​Reduced Weight & Size​​ – Replaces multiple single-layer boards with one compact unit.

✅ ​​Enhanced Durability​​ – Multiple layers provide structural strength.

♦ Common Layer Configurations​?​

Layers Typical Applications
​2-Layer​ Simple electronics (basic controllers, power supplies)
​4-Layer​ Consumer electronics (routers, IoT devices)
​6-Layer to 8-Layer​ Industrial controls, automotive systems
​10-Layer+​ High-speed digital (servers, telecom, aerospace)

♦ ​​Manufacturing Process​​:

  1. ​​Inner Layer Imaging​​ – Etching circuit patterns on inner copper layers.
  2. ​​Lamination​​ – Stacking layers with prepreg and pressing under heat.
  3. ​​Drilling​​ – Creating holes for vias and component leads.
  4. ​​Plating​​ – Electroless/electrolytic copper deposition for conductivity.
  5. ​​Outer Layer Patterning​​ – Applying photoresist and etching outer layers.
  6. ​​Solder Mask & Surface Finish​​ – Protecting copper with ENIG, HASL, or OSP.

Technical Parameters

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

One-Stop PCBs Solution

Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm
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Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm Medical HDI Multilayer PCBA Circuit Board Fast Turn PCB Production 2.0mm
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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

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